A two component, room temperature cure patching and sealing compound. This product has excellent adhesion to plastics and various metals. CLC 16-228
High strength. A two part, five minute epoxy with high strength for quick repair applications. CLC 16-320
RT Cure, 5 Minute adhesive. Clear when cured, good for quick repairs. CLC 16-600
Flexible polyurethane system for potting and casting in electrical applications. A two component, low viscosity, low durometer, polyurethane potting compound. The cured material meets the requirements of UL94-V0. CLP 7106 / CLI 4010
Heat Cure Semi-Rigid Epoxy Transformer Casting System. Increased flexibility when compared to CLR 1331 / CLH 5515 family. System exhibits excellent thermal stability and thermal cycling performance. A two component, heat cure epoxy system specifically developed for use on instrument and power transformers. Product meets UL94-HB flammability requirements. CLR 1157 / CLH 5515
A low viscosity, two component, unfilled, room temperature cure, epoxy system. This system provides resiliency and strength making it suitable for a variety of applications. ie. adhesives, castings, coatings and tooling. CLR 1180 / CLH 6020
Flexible epoxy casting and potting system. An unfilled, semi-flexible epoxy casting system with long pot life. This product may be used in large mass casting. CLR 1180 / CLH 6520
Room temp cure, Excellent shock resistance. An exceptional epoxy casting system with excellent thermal and mechanical shock resistance. CLR 1180 / CLH 6560
A two component, unfilled, room temperature cure epoxy, for coating, casting, and adhesive applications. CLR 1180 / CLH 6770
Room temp cure, excellent shock resistance. An exceptional epoxy laminating system with excellent thermal and mechanical shock resistance. Product is suitable for a variety of applications. CLR 1180 / CLH 6930
Shock resistant, General purpose epoxy. A two component epoxy casting system. product has low shrinkage and excellent shock resistance. CLR 1183 / CLH 6560
Low viscosity, RT cure. Impact resistant. Excellent thermal cycle. An exceptionally tough epoxy casting system with excellent low temperature thermal and mechanical shock resistance. CLR 1190 / CLH 6560
Clear low viscosity semi-flexible adhesive / sealant. A low viscosity, two component unfilled, room temperature cure epoxy system. CLR 1205 / CLH 6770
Extremely strong adhesive. Remains strong at elevated temperatures. A high performance, room temperature curing, 100% solids, epoxy adhesive. This product bonds to a wide variety of substrates and was specifically developed to seal porous metal substrates. CLR 1396 / CLH 6930
Low viscosity, RT cure. Excellent thermal shock resistance. A low viscosity adhesive with excellent thermal and mechanical shock resistance. CLR 1510 / CLH 6580
Heat and chemical/fuel resistant adhesive/laminating. A two component heat and chemical resistant epoxy laminating system. CLR 1730 / CLH 6372
UL 94-V0 system for potting and casting small electronic parts that require thermal shock and thermal cycling performance. A two component, low viscosity, room temperature cure epoxy system. Material has yellow card UL94-V0 rating, and contains non abrasive fillers suitable for meter mix dispense. CLR 1796 / CLH 6580
Product is machine dispense friendly. A filled, high temperature operating, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive fillers and convenient mix ratio makes it suitable for processing in automatic dispense equipment. As part of an insulating system, it will meet class H, electrical temperature. This product meets UL94-V1 in house flammability testing. CLR 1820 / CLH 6440
UL 94-V1 Epoxy system for casting and potting electrical and electronic components, as part of an electrical insulating system it will meet Class H electrical temperature classification. A filled, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive filler and convenient mix ratio makes it suitable for processing in automatic dispense equipment. CLR 1821 / CLH 6441
1:1 Mix Ratio, Fast Gel, Medium viscosity, Flameout, 180°C operating, Ballast potting. A filled, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive filler and convenient mix ratio make it suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing. CLR 1826 / CLH 6445